High purity W Sputtering Target Tungsten target 99.95%
Specification of W Sputtering Target
JX metal specializes in producing high purity Tungsten Sputtering Targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.
Our standard Sputtering Targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations and threading, beveling, grooves and backing designed to work with both older sputtering devices as well as the latest process equipment, such as large area coating for solar energy or fuel cells and flip-chip applications. Research sized targets are also produced as well as custom sizes and alloys.
All targets are analyzed using best demonstrated techniques including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment.
We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation.
1. Grade: W1
2. Purity :> =99.95%
3. Characteristic:
Melting Point: 3410°C
Boiling Point:5927°C
Density: 19.3g/cm3
High quality, workability
4. Certificate: ISO9001:2008
5. Product Feature: High melting point, High-density, high temperature oxidation resistance, long service life, resistance to corrosion..
6. More details about tungsten target
As-rolled Surface Finish |
Ground Surface Finish |
||
Minimum Thickness |
0.125”+/-0.020” |
Minimum Thickness |
0.125”+/-0.005” |
Maximum Width |
12” |
Maximum Width |
12” |
Maximum Length |
24” |
Maximum Length |
24” |
Maximum Thickness |
0.400”+/-0.030” |
Maximum Thickness |
0.400”+/-0.005” |
Maximum Width |
12” |
Maximum Width |
12” |
Maximum Length |
12” |
Maximum Length |
12” |
7.Application: Sputtering targets are wildly used in decorative coating industry, semiconductor, electronic, displayer, solar energy, Integrated circuit, optical element, Function coating, Surface decoration, Glass coating, micro-electronics, Miniature components, Optical communication, Medical devices and so on